top of page

Photoresist Technical Info

For use in "Positive Lithography" our standard photoresist is AZ 1500 series  with a thickness  @ 5,300Å / 10,000Å . Non-standard thicknesses are 15,000Å/ 20,000Å/ 25,000Å. Utilizing a spin technique to apply the resist which leaves the substrate fringeless and with excellent adhesion our substrates have become the standard for photomask blanks.  Baked @ 103° Celsius for 30 minutes, this standard procedure can be altered to meet customer specifications.  Click the link below to see technical data on the Photoresist. 

bottom of page