Photoresist Technical Info
For use in "Positive Lithography" our standard photoresist is AZ 1500 series with a thickness @ 5,300Å / 10,000Å . Non-standard thicknesses are 15,000Å/ 20,000Å/ 25,000Å. Utilizing a spin technique to apply the resist which leaves the substrate fringeless and with excellent adhesion our substrates have become the standard for photomask blanks. Baked @ 103° Celsius for 30 minutes, this standard procedure can be altered to meet customer specifications. Click the link below to see technical data on the Photoresist.