For use in "Positive Lithography" our standard photoresist is AZ 1518 & AZTFP650 with thicknesses  @ 5,300Å / 10,000Å . Non-standard thicknesses are 15,000Å/ 20,000Å/ 25,000Å. Utilizing a spin technique to apply the resist which leaves the substrate fringless and with excellent adhesion our substrates have become the standard for photomask blanks.  Baked @ 100° fahrenheit for 30 minutes, this standard procedure can be altered to meet customer specifications.  Click the links below to see technical data on the Photoresist. 

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